The products and modern electronic equipment produce a large amount of heat, generated by the high power components, this negatively influence the optimal functioning of the final product.
For effective management of the surface temperature of sensitive electronic components, used in electronic assemblies, we offer products that are designed for heat dissipation and creating an efficient, stable and secure working environment.
Temperature management solutions:
- encapsulating compound
Films can be supplied in standard sizes or preform. Adhesives, pastes and encapsulation compounds can be packaged standard, for micro manufacturing or industrial manufacturing.